目 录

第1篇 机遇篇：半导体芯片全球进程与智造机遇

第1章 集成电路推动全球GDP增长与工业革命 ···············································2

1.1 集成电路推动全球GDP增长三十年与中国成就 ·······························2

1.1.1 半导体集成电路一直所处的战略领地 ···················································2

1.1.2 俄罗斯集成电路产业现状与未来电子战 ··············································18

1.1.3 我国软件与集成电路行业发展的三个十年 ···········································20

1.2 工业革命与不死摩尔定律 ··························································26

1.2.1 五次工业革命与半导体发展 ·····························································26

1.2.2 不死摩尔定律正从纳米深入埃米 ·······················································34

1.2.3 投资成本增势与产能预期 ································································38

第2章 美国科技制裁与中国自主替代 ······························································43

2.1 美国科技长臂管辖45年 ····························································43

2.2 美国白宫科技智囊与半导体军工组织 ···········································46

2.2.1 政府：近90年白宫科技智囊及其盟国科技智囊 ···································46

2.2.2 军工：DAPPA引领科研66年 ···························································51

2.3 凭使命改宿命、靠替代对制裁 ····················································56

2.3.1 国家科技咨询委员会智囊团呼之欲出 ·················································56

2.3.2 政、经、金、产四位一体推动集成电路行业发展 ··································58

2.3.3 《中国制造2025》中的集成电路 ························································63

2.3.4 中国行业巨头的跨界重塑 ································································67

第3章 集成电路与新信息技术交叉融合的智造机遇 ·········································73

3.1 智造工业软件生逢其时 ·····························································73

3.1.1 制造强国必强于工业软件 ································································73

3.1.2 工业软件支撑起全球最强工业企业 ····················································77

3.1.3 智造工业软件是半导体发展的黑武器 ·················································83

3.2 智能2—芯片与AI的交叉赋能 ·················································89

3.2.1 AI芯片引燃半导体产业爆发 ····························································89

3.2.2 AI是半导体智造的软核心 ·······························································93

3.2.3 集成电路与AI的互促成就 ······························································97

3.3 AI应用于集成电路的投资回报分析 ···········································100

第2篇技术篇：集成电路与New IT的跨界融合与智造技术

第4章智造软件持续加码全球半导体制造 ·····················································106

4.1 开启先进半导体智造之窗 ························································106

4.1.1 台湾的AI智造与竞争基础：工业3.5 ················································106

4.1.2 从生产自动化迈向工程自动化 ·························································111

4.2 半导体智造软件的极致力量 ·····················································114

4.2.1 半导体制造三大极致挑战 ·······························································114

4.2.2 工业互联数据汇聚的平台化 ····························································122

4.2.3 数据科技在半导体制造中崭露头角 ···················································125

4.3 智能学习仓库与数字孪生 ························································131

4.4 智造软件提升芯片制造的KPI ··················································134

4.4.1 良率是晶圆生产的生命线与终极挑战 ················································134

4.4.2 数据科技应用于制程良率管理 ·························································135

4.4.3 AI模糊神经网络赋能良率预测与生产排程 ·········································139

第5章智造软件为半导体产业提供全程价值 ·················································144

5.1 头部半导体厂商对AI应用的洞察·············································144

5.1.1 英伟达 ·······················································································145

5.1.2 科磊 ··························································································146

5.1.3 泛林 ··························································································147

5.1.4 欧洲微电子研究中心 ·····································································148

5.1.5 迈康尼 ·······················································································150

5.2 半导体服务厂商的智造方案 ·····················································151

5.2.1 DataProphet的AI即服务方案 ··························································151

5.2.2 Onto Innovation的创新数据驱动解决方案··········································152

5.2.3 D2S的GPU加速方案 ···································································154

第6章 来自世界头部半导体制造厂商的智造验证 ··········································156

6.1 英特尔20年的AI智造之路 ·····················································158

6.1.1 AI在英特尔整厂应用的方法论 ························································158

6.1.2 优化AI应用排序以提升商业价值 ····················································159

6.1.3 英特尔实现AI智造的典型案例 ·······················································161

6.2 台积电11年的AI智造与大联盟OIP··········································168

6.2.1 台积电的智造战略 ········································································169

6.2.2 台积电的智造案例 ········································································178

6.2.3 台积电向客户提供的虚拟晶圆厂 ······················································184

6.2.4 台积电大联盟的开放式创新平台 ······················································185

6.3 中芯国际的10年智造之路 ·······················································193

6.3.1 2011年打造云端工厂的成果 ···························································194

6.3.2 2018年关于实施智能制造战略的成果 ···············································196

6.3.3 2020年打造中芯国际工业互联网平台 ···············································198

6.4 其他知名半导体厂商的智造实践 ···············································199

6.4.1 格芯 ··························································································199

6.4.2 美光 ·························································································200

第7章 来自世界头部半导体设备厂商的智造验证 ··········································202

7.1 阿斯麦是卓越的工业软件公司 ··················································202

7.1.1 智控软件是光刻三十年来的灵魂 ······················································203

7.1.2 阿斯麦拥有世界最大开放软件社区 ···················································204

7.1.3 智能软件应用场景及案例 ·······························································205

7.1.4 EUV光刻机与 F-35隐身战机 ··························································207

7.2 应材的软硬一体 ····································································209

7.2.1 AI赋能晶圆缺陷检测 ····································································210

7.2.2 AI赋能晶圆制造产能爬坡及良率提升 ···············································211

7.2.3 AI赋能晶圆制造走向无人化“自动驾驶” ···········································213

7.2.4 应材的“全自动化半导体工厂”方案 ················································215

7.3 泛林的设备智能 ····································································217

7.3.1 泛林设备智能 ··············································································217

7.3.2 数字孪生/数字主线 ······································································217

7.3.3 虚拟工艺开发、智能工具与数字服务 ················································218

第3篇管理篇：未来科技与产业发展借鉴

第8章未来科技与半导体智造 ·······································································222

8.1 超级人类与未来科技······························································222

8.1.1 从“增长的极限”到“超级人类” ····················································222

8.1.2 中国“十四五”规划的七大前沿科技 ················································228

8.1.3 欧美未来科技预测及策略 ·······························································233

8.2 半导体智造的远景方略 ···························································235

8.2.1 半导体未来十年发展与挑战 ····························································235

8.2.2 半导体智造方略 ···········································································237

8.2.3 面向未来的工业4.0晶圆工厂 ··························································241

8.2.4 5G在半导体领域的前瞻性应用 ························································244

第9章半导体产业展望及工业4.0创新 ·························································246

9.1 美国半导体行业组织管理借鉴 ··················································246

9.1.1 SIA推动美国半导体产业发展 ·························································246

9.1.2 SEMATECH推动美国半导体制造 ····················································247

9.2 半导体工业4.0转型中的关键管理 ·············································250

9.2.1 数字化冠军企业转型的战略定位 ······················································250

9.2.2 数字化冠军企业转型的变革管理 ······················································252

9.2.3 英特尔、台积电与三星的创新转型案例 ·············································253

9.3 半导体产业工业4.0转型的框架应用 ··········································262

9.3.1 TüV工业4.0成熟度模型九宫格 ······················································262

9.3.2 EDB工业智能成熟度指数 ······························································264

9.3.3 IMPLUS工业4.0成熟度自评 ··························································267

结语 ··················································································································270

致谢 ··················································································································272